Makers of ultrasonic generators and transducers for ultrasonic and thermosonic wire bonders
With over 60,000 units installed worldwide, Uthe has supplied the semiconductor industry with more generators and transducers than all other manufacturers combined.
Uthe’s research and development achievements have paralleled the growth and sophistication of semiconductor assembly process. Uthe’s wire bonding peripherals are at the heart of industry advances in high frequency bonding, copper bonding, and low temperature bonding.
Uthe customers consist of more than 500 different end-users. Ninety percent of the company’s OEM sales were made to a number of bonding machine manufacturers including ASM International; F & K Delvotec S.A.; Dias Automation Ltd.; Marpet Industries, Inc.; Hybond, Inc.; SMH (Taiwan); ESEC; Mitsubishi, Hesse and Knipps, and many other equipment manufacturers.
Other customers include captive semiconductor manufacturers who produce bonding machines for their own use or for resale, such as General Motors, Philips, Hitachi, IBM, Texas Instruments, and Toshiba.
Ultrasonic Products Include
- Dual-Frequency Oscillators
- Metal Joining Machines
- Welding Machines
- Sieving Machines
Address: Uthe Japan Co., Ltd., 4F Shinyokohama Urban Square Building, 1-3-1 Shinyokohama Kohoku-ku, JP-222-0033 Yokohama-shi, Japan
Name: Mr. Hiromasa Tonozuka